At this year’s OCP Global Summit, Microsoft will share our latest contributions to supercomputing architecture and hardware intended to support the new era through standardization and innovation.
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Microsoft has made a number of contributions to and collaborated with various members of the Open Compute Project (OCP) community, the leading industry group dedicated to open source hardware innovation. This year, we are excited to showcase some of our newest projects at the OCP Global Summit.
Here at Microsoft, we’ve empowered our long-standing partners in the semiconductor industry to embrace Azure’s cloud infrastructure and scale out electronic design automation (EDA). With a new EDA-optimized cloud environment running on Azure, the launch of the Synopsys Cloud marks a significant milestone for the industry by offering silicon design teams the ability to scale and accelerate their development cycles—transforming chip design the way that the cloud transformed computing.
To deliver the most sustainable, scalable, and reliable cloud for Azure customers, continued innovation in cloud hardware is a constant priority for Microsoft. Learn more about how Microsoft’s Circular Centers are extending the lifespan of our servers with the goal of increasing component reuse by up to 90 percent.
Leading hardware engineering at “the” software company is not as strange as it sounds, as the Microsoft Cloud depends on hardware as the foundation of trust, reliability, capacity, and performance, to make it possible for Microsoft and our customers to achieve more.
Right now, every industry and every customer is going through a massive transformation, and cloud computing is often a central enabler of this.